Izixhobo zezibane ze-LED: i-semiconductor material chip, iglue emhlophe, ibhodi yesekethe, i-epoxy resin, i-core wire, igobolondo.Isibane se-LED yi-chip ye-electroluminescent semiconductor material, ephiliswa kwi-bracket ngeglue yesilivere okanye iglue emhlophe, kwaye emva koko idibanisa i-chip kunye nebhodi yesekethe ngocingo lwesilivere okanye ucingo lwegolide.Indawo ejikelezileyo ivalwe nge-epoxy resin ukukhusela i-core core wire.Umsebenzi, ekugqibeleni faka igobolondo, ngoko isibane se-LED sinomsebenzi omhle we-seismic.

I-LED ye-light-emitting diode yi-solid state semiconductor device enokuguqula amandla ombane ekukhanyeni okubonakalayo.Inokuguqula ngokuthe ngqo umbane ekukhanyeni.Intliziyo ye-LED yi-chip ye-semiconductor, enye isiphelo se-chip ifakwe kwinkxaso, enye isiphelo sisibonda esibi, kwaye esinye isiphelo sidityaniswe kwisibonda esilungileyo sonikezelo lwamandla, ukuze yonke i-chip ifakwe. nge epoxy resin.

Umgaqo wokukhanyisa izibane ze-LED

Xa i-current idlula kwi-wafer, i-electrons kwi-semiconductor yohlobo lwe-N kunye nemingxuma kwi-semiconductor yohlobo lwe-P ingqubuzana ngobundlobongela kwaye iphinde iphinde iphinde iphinde iphinde iphinde iphinde ivelise i-photons, ekhupha amandla ngendlela yeefotoni (oko kukuthi. , ukukhanya okubonwa ngumntu wonke).I-semiconductors yezixhobo ezahlukeneyo ziya kuvelisa imibala eyahlukeneyo yokukhanya, njengokukhanya okubomvu, ukukhanya okuluhlaza, ukukhanya okuluhlaza okwesibhakabhaka njalo njalo.

Phakathi kweeleyile ezimbini ze-semiconductors, ii-electron kunye nemingxuma zingqubana kwaye ziphinde zidibanise kwaye zivelise iifotoni eziluhlaza okwesibhakabhaka kwi-light-emitting layer.Inxalenye yokukhanya okuluhlaza okwenziweyo iya kukhutshwa ngokuthe ngqo kwi-coating ye-fluorescent;inxalenye eseleyo iyakubetha i-fluorescent coating kwaye inxibelelane nayo ukuvelisa iifotoni ezityheli.Ifoton eluhlaza okwesibhakabhaka kunye nefoton ephuzi isebenza kunye (ixutywe) ukuvelisa ukukhanya okumhlophe