Zeziphi iingenelo zeCOB xa kuthelekiswa ne-SMD?

I-SMD sisishunqulelo seSurface Mounted Device, equka izixhobo ezinje ngeekomityi zesibane, izibiyeli, iitshiphusi, iileyidi, kunye ne-epoxy resin kwiinkcukacha ezahlukeneyo zamaso esibane, emva koko yenze iimodyuli zokubonisa i-LED ngokuzithengisa kwibhodi yePCB ngendlela amabala.

Iziboniso ze-SMD ngokubanzi zifuna ukuba ubuhlalu be-LED buvezwe, obungabangeli ngokulula ukuthetha phakathi kweepikseli, kodwa kwakhona kubangela ukusebenza kakubi kokukhusela, okuchaphazela ukusebenza kwemifanekiso kunye nobomi benkonzo.

Umzobo wesicwangciso se-SMD microstructure

I-COB, efinyeziweyo njenge-Chip On Board, ibhekisa kwitekhnoloji yokupakisha ye-LED eqinisa ngokuthe ngqo iitshiphusi ze-LED kwiibhodi zesekethe eziprintiweyo (PCBs), endaweni yokuthengisela iipakethi ze-LED ezinokwakheka komntu kwiiPCB.

Le ndlela yokupakisha ineenzuzo ezithile kwimveliso kunye nokusebenza kakuhle, umgangatho womfanekiso, ukhuseleko, kunye nezicelo ezincinci zokubeka isithuba.


Ixesha lokuposa: Jul-05-2023
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